KTC COMPONENT TESTING PROTOCOLS

ALL PARTS

Chart
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
2D X-ray imaging inspection Inspect for the consistent of shape and size, internal structure
Electrical Measurement Inspect for gross errors
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
Electrical Measurement Inspect for gross errors
2D X-ray imaging inspection For Tantalum Capacitor Inspect for the consistent of shape and size of tantalum slug, the correct of polarity, the consistent of terminal frame design, the quality of joint at both cathode and anode
For MLCC Inspect for the consistent of size and numbers of layers of electrode
Cross-section For Tantalum Capacitor Inspect for the quality of coating, joint at terminal
For MLCC Inspect for the consistent of gap between layers of electrode and terminal plating quality
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
2D X-ray imaging inspection Inspect for consistent of internal components layout
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
2D X-ray imaging inspection Inspect for the consistent of shape and size, correct of polarity
Decapsulation Inspect for internal element
External inspection Inspect for quality of plastic case, consistent of die size and wirebonding
Wavelength inspection Require Wave spectrometer
2D X-ray imaging inspection Inspect for the consistent of die size and wirebonding
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
2D X-ray imaging inspection Inspect for internal physical and components layout
Decapsulation Inspect for internal circuitry and components
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
2D X-ray imaging inspection Inspect for the consistent of die size, wirebonding diagram
Decapsulation Inspect for die ID, manufacturer, metallization pattern
External inspection Inspect for marking and physical structure. In case of ink marking, wipe the marking with cotton bud damped with acetone. Some of the counterfeit's ink marking may be wiped out easily by acetone.
2D X-ray imaging inspection Inspect for the consistent of die size, wirebonding diagram, leadframe design
Decapsulation Inspect for die ID, manufacturer
Electrical Testing Continuity or functional testing